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S-Plastic Lexan PC HPS1 High Flow Medical Devices Pharmaceutical Applications Healthcare Biocompatible E-Beam Gamma

100KG
MOQ
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S-Plastic Lexan PC HPS1 High Flow Medical Devices Pharmaceutical Applications Healthcare Biocompatible E-Beam Gamma
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Features
Specifications
Melt Flow Rate, 300°C/1.2 Kgf: 25
Mold Release.: Internal
ISO10993 Or USP Class VI: YES
Steam Sterilizable: YES
E-beam Sterilizable: YES
Gamma Sterilizable: YES
Basic Infomation
Place of Origin: ——
Brand Name: S-Plastic Lexan
Certification: COA/ICP Test/Rohs/MSDS
Model Number: HPS1
Payment & Shipping Terms
Packaging Details: 25KG/BAG
Delivery Time: To be negotiated
Payment Terms: L/C, T/T, Western Union, MoneyGram
Supply Ability: To be negotiated
Product Description

S-Plastics Lexan HP2 resin is high flow polycarbonate(MFR 25). For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible(ISO10993 or USP Class VI). EtO, e-beam and gamma sterilizable. Contains mold release.

 

 

LEXAN is a product of S-Plastics, a polycarbonate resin. Lexan PC is made of bisphenol A, a polymer material for polycarbonate, which has high-quality heat resistance properties, physical and mechanical properties such as good transparency and extremely high impact strength. Polycarbonate colorless transparent, heat resistant, shock resistant, flame retardant (BI grade), good mechanical properties in the ordinary use temperature. The same properties are close to polymethyl Compared with methyl acrylate, polycarbonate has good impact resistance, high refractive index, good processing performance, and has UL94 V-0 flame retardant performance.

The three major application areas of PC engineering plastics are the glass assembly industry, the automotive industry and the electronics and electrical industry. Now it is widely used in electronic appliances, office supplies, precision machinery, automobiles, medical, labor insurance and household goods and many other fields. Lexan is continuously developing and researching for future needs.


Properties

MECHANICAL Value Unit Standard
Tensile Stress, yld, Type I, 50 mm/min 62 MPa ASTM D 638
Tensile Stress, brk, Type I, 50 mm/min 65 MPa ASTM D 638
Tensile Strain, yld, Type I, 50 mm/min 6 % ASTM D 638
Tensile Strain, brk, Type I, 50 mm/min 120 % ASTM D 638
Tensile Modulus, 50 mm/min 2370 MPa ASTM D 638
Flexural Stress, yld, 1.3 mm/min, 50 mm span 93 MPa ASTM D 790
Flexural Modulus, 1.3 mm/min, 50 mm span 2300 MPa ASTM D 790
Hardness, Rockwell M 70 - ASTM D 785
Hardness, Rockwell R 118 - ASTM D 785
Taber Abrasion, CS-17, 1 kg 10 mg/1000cy ASTM D 1044
Tensile Stress, yield, 50 mm/min 63 MPa ISO 527
Tensile Stress, break, 50 mm/min 50 MPa ISO 527
Tensile Strain, yield, 50 mm/min 6 % ISO 527
Tensile Strain, break, 50 mm/min 70 % ISO 527
Tensile Modulus, 1 mm/min 2350 MPa ISO 527
Flexural Stress, yield, 2 mm/min 90 MPa ISO 178
Flexural Modulus, 2 mm/min 2300 MPa ISO 178
Hardness, H358/30 95 MPa ISO 2039-1
IMPACT Value Unit Standard
Izod Impact, unnotched, 23°C 3204 J/m ASTM D 4812
Izod Impact, notched (natural, tints) 640 J/m ASTM D 256
Izod Impact, notched (colors) 106 - 640 J/m ASTM D 256
Tensile Impact, Type "S" 378 kJ/m² ASTM D 1822
Falling Dart Impact (D 3029), 23°C 169 J ASTM D 3029
Instrumented Impact Energy @ peak, 23°C 54 J ASTM D 3763
Izod Impact, unnotched 80*10*4 +23°C NB kJ/m² ISO 180/1U
Izod Impact, unnotched 80*10*4 -30°C NB kJ/m² ISO 180/1U
Izod Impact, notched 80*10*4 +23°C 12 kJ/m² ISO 180/1A
Izod Impact, notched 80*10*4 -30°C 10 kJ/m² ISO 180/1A
Charpy 23°C, V-notch Edgew 80*10*4 sp=62mm 12 kJ/m² ISO 179/1eA
Charpy -30°C, V-notch Edgew 80*10*4 sp=62mm 10 kJ/m² ISO 179/1eA
THERMAL Value Unit Standard
HDT, 0.45 MPa, 6.4 mm, unannealed 137 °C ASTM D 648
HDT, 1.82 MPa, 6.4 mm, unannealed 126 °C ASTM D 648
CTE, -40°C to 95°C, flow 6.84E-05 1/°C ASTM E 831
Specific Heat 1.25 J/g-°C ASTM C 351
Thermal Conductivity 0.19 W/m-°C ASTM C 177
Thermal Conductivity 0.2 W/m-°C ISO 8302
CTE, 23°C to 80°C, flow 7.E-05 1/°C ISO 11359-2
Ball Pressure Test, 125°C +/- 2°C PASSES - IEC 60695-10-2
Vicat Softening Temp, Rate B/50 139 °C ISO 306
Vicat Softening Temp, Rate B/120 140 °C ISO 306
HDT/Be, 0.45MPa Edgew 120*10*4 sp=100mm 133 °C ISO 75/Be
HDT/Ae, 1.8 MPa Edgew 120*10*4 sp=100mm 121 °C ISO 75/Ae
PHYSICAL Value Unit Standard
Specific Gravity 1.2 - ASTM D 792
Specific Volume 0.83 cm³/g ASTM D 792
Density 1.19 g/cm³ ASTM D 792
Water Absorption, 24 hours 0.15 % ASTM D 570
Water Absorption, equilibrium, 23C 0.35 % ASTM D 570
Water Absorption, equilibrium, 100°C 0.58 % ASTM D 570
Mold Shrinkage, flow, 3.2 mm 0.5 - 0.7 % S-Plastics Method
Melt Flow Rate, 300°C/1.2 kgf 25 g/10 min ASTM D 1238
Density 1.2 g/cm³ ISO 1183
Melt Volume Rate, MVR at 300°C/1.2 kg 23 cm³/10 min ISO 1133
OPTICAL Value Unit Standard
Light Transmission 88 % ASTM D 1003
Haze 1 % ASTM D 1003
Refractive Index 1.586 - ASTM D 542
ELECTRICAL Value Unit Standard
Volume Resistivity >1.E+17 Ohm-cm ASTM D 257
Dielectric Strength, in air, 3.2 mm 14.9 kV/mm ASTM D 149
Relative Permittivity, 50/60 Hz 3.17 - ASTM D 150
Relative Permittivity, 1 MHz 2.96 - ASTM D 150
Dissipation Factor, 50/60 Hz 0.0009 - ASTM D 150
Dissipation Factor, 1 MHz 0.01 - ASTM D 150
Volume Resistivity >1.E+15 Ohm-cm IEC 60093
Surface Resistivity, ROA >1.E+15 Ohm IEC 60093
Dielectric Strength, in oil, 3.2 mm 17 kV/mm IEC 60243-1
Relative Permittivity, 50/60 Hz 2.7 - IEC 60250
Relative Permittivity, 1 MHz 2.7 - IEC 60250
Dissipation Factor, 50/60 Hz 0.001 - IEC 60250
Dissipation Factor, 1 MHz 0.01 - IEC 60250
FLAME CHARACTERISTICS Value Unit Standard
Oxygen Index (LOI) 25 % ISO 4589
Source GMD, last updated:01/04/2000    

Processing

Injection Molding Value Unit
Drying Temperature 120 °C
Drying Time 3 - 4 hrs
Drying Time (Cumulative) 48 hrs
Maximum Moisture Content 0.02 %
Melt Temperature 270 - 295 °C
Nozzle Temperature 265 - 290 °C
Front - Zone 3 Temperature 270 - 295 °C
Middle - Zone 2 Temperature 260 - 280 °C
Rear - Zone 1 Temperature 250 - 270 °C
Mold Temperature 70 - 95 °C
Back Pressure 0.3 - 0.7 MPa
Screw Speed 40 - 70 rpm
Shot to Cylinder Size 40 - 60 %
Vent Depth 0.025 - 0.076 mm
Source GMD, last updated:01/04/2000  
 
 
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