S-Plastics Thermocomp Lexan_EXCP0008 resin is a 20% glass beads filled PC injection moulding resin.
| MECHANICAL | Value | Unit | Standard |
| Tensile Stress, yield, 5 mm/min | 63 | MPa | ISO 527 |
| Tensile Strain, break, 5 mm/min | 7.5 | % | ISO 527 |
| IMPACT | Value | Unit | Standard |
| Izod Impact, notched 80*10*4 +23°C | 8 | kJ/m² | ISO 180/1A |
| PHYSICAL | Value | Unit | Standard |
| Density | 1.34 | g/cm³ | ISO 1183 |
| Melt Volume Rate, MVR at 300°C/1.2 kg | 41 | cm³/10 min | ISO 1133 |
| Source GMD, last updated:09/20/2001 | |||
| Parameter | ||
| Injection Molding | Value | Unit |
| Drying Temperature | 120 | °C |
| Drying Time | 2 - 4 | hrs |
| Maximum Moisture Content | 0.02 | % |
| Melt Temperature | 290 - 320 | °C |
| Nozzle Temperature | 280 - 310 | °C |
| Front - Zone 3 Temperature | 290 - 320 | °C |
| Middle - Zone 2 Temperature | 280 - 310 | °C |
| Rear - Zone 1 Temperature | 270 - 300 | °C |
| Hopper Temperature | 60 - 80 | °C |
| Mold Temperature | 80 - 120 | °C |
| Source GMD, last updated:09/20/2001 | ||
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For more information please download the datasheet |
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S-Plastics Thermocomp Lexan_EXCP0008.pdf |
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