HFD resin - Super high Flow + high impact PC
- Ultra-high fluidity (30-40% higher than normal PC) while maintaining high toughness. • The process effectively reduces the internal stress of the mold, thus avoiding birefringence defects.
- The molding temperature is about 20 degrees lower than that of ordinary PC, which allows the addition of some heat-sensitive additives
- Due to its high fluidity, the appearance defects of some glass fiber filling materials are solved
- Rapid prototyping, thus reducing the molding cycle, to help customers save the costs effectively.
- Cell phone case battery cover cell phone frame body
- Optical shield housing
- Polarized lens trunk housing
- Special film sun visor
- Housing of household appliances thin wall large size housing
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